Jan. 05, 2026
Case 1: Wafer Chuck Frame for a Vacuum Etch Tool
Client required an aluminum 6061 chuck frame machined to ±0.005 mm flatness, anodized and cleaned for vacuum. Rollyu produced 300 units over 6 months with zero non-conformances.
Industry: Semiconductor Equipment
Component: Wafer Chuck Frame
Material: Aluminum 6061
Tolerance: ±0.005 mm flatness
Surface Finish: Anodized and vacuum-cleaned
Volume: 300 units over 6 months
Challenge:
A leading semiconductor equipment manufacturer required a precision-machined chuck frame used in a vacuum etch tool. The part needed to maintain an ultra-flat surface with a tight flatness tolerance of ±0.005 mm to ensure even wafer support and gas flow uniformity. Additionally, the component had to be anodized for corrosion resistance and thoroughly cleaned for vacuum chamber compatibility.
Solution by Rollyu Precision:
Rollyu deployed 5-axis CNC machining and precision lapping techniques to achieve the required flatness across a complex geometry. Each part underwent full dimensional inspection using a calibrated CMM, followed by Type II anodizing and ISO 14644-compliant cleaning to remove microscopic contaminants.
Outcome:
300 units delivered on schedule over a 6-month period
Zero non-conformances reported by the customer
Achieved 100% vacuum integrity compliance during tool integration
Enabled the client’s tool to pass beta site evaluations with no mechanical revisions
Client Feedback:
"Rollyu’s precision machining and clean handling were instrumental in getting our etch tool qualified for high-volume semiconductor fabs. Their consistency and responsiveness made them a strategic partner."
Case 2: Sensor Block for Optical Alignment System
PEEK block with micro-tapped holes (M1.6) and pocketed sensor nest, machined using custom fixtures and inspected via CMM. Full RoHS and REACH compliance.
Industry: Semiconductor Metrology
Component: Sensor Mounting Block
Material: PEEK (Polyether ether ketone)
Features: M1.6 micro-tapped holes, precision pocket for sensor seating
Compliance: RoHS & REACH compliant
Inspection: CMM dimensional verification
Challenge:
A client developing an optical alignment system required a non-metallic sensor block with extreme dimensional stability and chemical resistance. The part featured micro-threaded M1.6 holes and a custom pocket profile for precise sensor seating—tolerances were tight due to the optical calibration requirements. Due to the softness and thermal sensitivity of PEEK, the machining approach had to avoid material stress and deformation.
Solution by Rollyu Precision:
Rollyu engineered custom soft-jaw fixtures to secure the part without inducing clamping distortion. A high-speed spindle and micro-tooling setup were used to achieve burr-free micro-taps and tight pocket tolerances. Full dimensional inspection was performed using a CMM, and all materials were traced to certified RoHS and REACH compliant sources.
Outcome:
Delivered precision-milled PEEK components with micro-tap threading success rate >99%
Maintained <0.01 mm tolerance across the critical sensor nest region
Verified 100% compliance with EU RoHS and REACH standards
Enabled accurate, repeatable sensor alignment in cleanroom optical systems
Client Feedback:
"PEEK is notoriously difficult to machine, but Rollyu delivered flawless parts with exceptional attention to detail. The precision of the sensor nest exceeded our expectations."
Stain
Case 3: Manifold Assembly Plate
Stainless steel 316L, post-machined with electropolishing and passivation. Threads held to class 3A tolerance. Designed for cleanroom fluid delivery systems.
Industry: Semiconductor Process Equipment
Component: Fluid Manifold Assembly Plate
Material: Stainless Steel 316L
Post-Processing: Electropolished + Passivated
Thread Spec: ASME Class 3A Tolerance
Application: Cleanroom fluid distribution system
Challenge:
A semiconductor OEM required a manifold plate capable of precise fluid routing in a Class 100 cleanroom environment. The part was made from corrosion-resistant 316L stainless steel and needed tight-tolerance threads (Class 3A) to ensure reliable, leak-free connections under pressure. Surface integrity was critical—requiring both electropolishing for roughness control and passivation for enhanced corrosion resistance.
Solution by Rollyu Precision:
Rollyu implemented a multi-step approach: precision CNC milling and tapping were followed by in-house thread gauging to ensure Class 3A conformity. Post-machining, parts were electropolished to achieve a smooth, contamination-resistant finish and then passivated per ASTM A967 standards. Each part underwent 100% visual and dimensional QC, including surface Ra testing.
Outcome:
Achieved Ra < 0.2 µm surface finish for fluid-contact surfaces
Thread concentricity and pitch held within 0.02 mm
Delivered components with no visible particulate under 10x magnification
Fully compliant with semiconductor cleanroom standards
Client Feedback:
"The manifold plates from Rollyu passed our internal audit without issue. The polished finish and tight threading were exactly what we needed for leak-free fluid handling in our advanced process modules."
Why Leading OEMs Trust Rollyu Precision
We’re not just a job shop—we’re a strategic manufacturing partner trusted by top-tier semiconductor equipment manufacturers. Why?
Responsiveness: Fast prototyping, NPI ramp-up, and quick-turn engineering changes
Capacity: Scalable production from 1 to 10,000 parts
Cleanliness: Dedicated clean packaging area for ISO 14644-compatible shipments
Collaboration: Our engineers work hand-in-hand with your design team
Cost Control: Lean manufacturing and design-for-manufacturability reviews
Future of Semiconductor Machining – Our Perspective
As the semiconductor industry trends toward 2 nm nodes, EUV lithography, 3D packaging, and quantum integration, component complexity and criticality will continue to increase. This means tighter tolerances, exotic materials, and more demanding traceability and cleanliness requirements.
At Rollyu, we’re investing in:
Closed-loop machine control and Industry 4.0 integration
Tool wear prediction using AI and sensor fusion
Diamond tooling for ultra-fine surface finishes
Ceramic hybrid machining technologies
Real-time SPC dashboards for process stability
Our mission is to stay ahead of the curve—ensuring our customers receive parts that are not just precise, but engineered for tomorrow’s semiconductor breakthroughs.
Let’s Build the Future of Semiconductors—Together
From prototypes to production, from vacuum chambers to optical sensor mounts—Rollyu Precision delivers CNC machined parts that enable the semiconductor industry to push the boundaries of nanotechnology.
Whether you’re designing a new EUV platform, automating your wafer handling system, or building the next generation of quantum chips, we’re here to support you with expert machining, responsive service, and zero-defect quality.
